During April 18 to April 19, 2015, 2015 CASPA hi-tech
hob fair was held at Marriott hotel in Silicon Valley. Hefei Consortium of
Integrated Circuits Technology Innovation and Hefei Semiconductor Industry
Development Co., Ltd grouped together to attend the job fair.
CASPA job fair dedicates to promote the mutual
communication and interaction between talents and companies and has developed
into one of the largest hi-tech job fairs in IC industry worldwide since the
first job fair was held in 1995. 2015 CASPA hi-tech job fair has attracted many
world-famous enterprises including TSMC, ARM, BROADCOM, KILOPASS, MEDIATEK,
SIPO, Synaptics, Skyworks, Silego, Huawei and about one thousand job
applicants, covering IC software/hardware engineers and professionals from
other aspects. During the job fair, Hefei delegation freely communicated with
many job applicants and introduced present industrial situation of Hefei IC
industry, superior working and living environment to applicants. Part of these
job applicants expressed strong interest in working in Hefei and submitted their
resumes.
During the
job fair, Tao Hong, president of HFSID met with Ju Li president of CASPA, John
Lee, vice president of SVCTBA, Wei Lieheng, manager of HR department of TSCM
and other members of CASPA. The members
praised the achievements Hefei IC industry has obtained in recent 2 years and
expressed willingness of enhancing communication between CASPA and Hefei and promoting
further cooperation between IC companies in Silicon Valley and Hefei.
Attending
2015 CASPA hi-tech job fair plays avital role in
expanding influence of Hefei IC industry to the worldwide and recruiting more
IC cutting-edge talents to work in Hefei. 
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