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Hefei Held a Contract-signing Ceremony for IC Industry Programs
Release date:2014-01-14 Browse the number:3692
On
January 13, 2014, the contract-signing ceremony for programs of IC industry was
held at Hefei Governmental & Cultural New District. Total 14 programs
related IC signed contracts with Hefei and the total investment amount reaches
8.278 billion yuan.
It’s
reported that the signed programs included Spreadtrum Communications Hefei
R&D center, MediaTek Hefei R&D center and car electronics chip program,
GigaDeviceHefei R&D center, Datang strategic cooperation program, Ingenic
ultra low energy microprocessor program etc.
Besides,
three packaging programs and ZTE VC fund for IC industry program are also launched
in Hefei.
Leaders
from Anhui Provincial Government and Hefei Municipal Government attended the
ceremony. Up to now, Hefei has achieved several title like as the largest FPD base,
the largest household appliances manufacturing bases, important automobile
bases, equipment and new energy manufacturing bases etc. The most of the signed
programs have the intensive connection with the current local industry.
Hefei Semiconductor Development Co.,Ltd. All Rights Reserved ADD: BuildingA3,Innovation Industrial Park,No.800 WestWangjiangRoad,Hefei,Anhui230088,P.R.China
